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<Specification(JIS) #1500 >
◎ 적용산업
실리콘 태양전지셀 웨이퍼커팅 (Silicon solar cell wafer cutting)
반도체 웨이퍼 커팅 (Cutting semiconductor wafers)
세라믹 기계적인 밀봉 (Ceramics Mechanical seal)
첨단 내화재 (Advanced Refractory)


[ 평균입경 ]
D50
D3
D94
D0
8+/-0.6
15
5
23

[ 함량 ]
SiC
Fe2O3
F.C
F.Si
Moisture
≥98.5
≤0.2
≤0.2
≤0.3
≤0.2

- PH. 6-7
- Circularity≤0.38